[IMP] firmware_bootloader: Allow BC127 management * Add code to manage (including FW upgrades) the BC127 module via the system UART * Decrease Bootloader timeout to 5 seconds * Decrease bootloader memory footprint to 1kB * Fix issue causing lag starting the application post firmware write

[FIX] firmware_application: Minor updates * Add ISRs for NVMError and GeneralError traps * Move application code to 0x1800 to allow for larger bootloader * Single partition mode set explicitly

[FIX] firmware_bootloader: Fixes for firmware writing * Enlarge bootloader to 0x1000 bytes * Call application code via void pointer, rather than ASM * Add logic to erase FLASH memory prior to writing it out * Add logic to write out the RESET vector after clearing out the 0x00 page

[FIX] firmware_bootloader: Fixes to allow flash writing * Fix protocol decoding issues * Fix issues sending legitimate messages to the host * Fix issues writing data to flash * Document codebase

[IMP] firmware_bootloader: Add RX Queue timeout * Add 1 second timeout to RX queue to prevent bytes from becoming stuck

[IMP] hardware: Silkscreen / Power rail update * Adjust silkscreen text for PICKIT to locate it below the pins, rather than under * Remove 45 degree angles from 3.3v rail to PIC24 * Remove skew from the VIN wiring near the 100uF cap

[IMP] firmware: Break Bootload out of Application * Move Bootloader code over to its own project * Update gld scripts and build configurations to match project names * Devise Communication protocol for host to communicate with bootloader * Devise method of flashing firmware to MCU

[ADD] firmware: Begin Bootloader * Add Build config for application / bootloader * Add Application/Bootloader Linker Scripts (Default for now). * Remove gitignore for Makefiles for each configuration so that others can build it correctly too * Move System configuration to config.h so it can be included in both

[ADD] hardware: Update PWP * Correctly add tStop/bStop layer to TPA6017A2 to remove silkscreen from thermal pad

[ADD] hardware: BlueBus v6 * Version bump for new PCB run * Remove passives from IBus line causing I/O issues * Rewire gain settings on TPA6017A2 to 10dB gain, rather than 15.7dB * Ensure all vias are 0.51mm * Add Thermal Pad (PWP) to TPA6017A2 and update footprint to make more sense in mm * Rewire VIN * Rewire 5v regulator BS pin to pull from 5v rail rather than SW line (pre-inductor) per the DS