t3ddftw / BlueBus - History

[IMP] firmware_bootloader: Allow BC127 management
* Add code to manage (including FW upgrades) the BC127 module via the system UART
* Decrease Bootloader timeout to 5 seconds
* Decrease bootloader memory footprint to 1kB
* Fix issue causing lag starting the application post firmware write

[FIX] firmware_application: Minor updates
* Add ISRs for NVMError and GeneralError traps
* Move application code to 0x1800 to allow for larger bootloader
* Single partition mode set explicitly

[FIX] firmware_bootloader: Fixes for firmware writing
* Enlarge bootloader to 0x1000 bytes
* Call application code via void pointer, rather than ASM
* Add logic to erase FLASH memory prior to writing it out
* Add logic to write out the RESET vector after clearing out the 0x00 page

[FIX] firmware_bootloader: Fixes to allow flash writing
* Fix protocol decoding issues
* Fix issues sending legitimate messages to the host
* Fix issues writing data to flash
* Document codebase

[IMP] firmware_bootloader: Add RX Queue timeout
* Add 1 second timeout to RX queue to prevent bytes from becoming stuck

[IMP] hardware: Silkscreen / Power rail update
* Adjust silkscreen text for PICKIT to locate it below the pins, rather than under
* Remove 45 degree angles from 3.3v rail to PIC24
* Remove skew from the VIN wiring near the 100uF cap

[IMP] firmware: Break Bootload out of Application
* Move Bootloader code over to its own project
* Update gld scripts and build configurations to match project names
* Devise Communication protocol for host to communicate with bootloader
* Devise method of flashing firmware to MCU

[ADD] firmware: Begin Bootloader
* Add Build config for application / bootloader
* Add Application/Bootloader Linker Scripts (Default for now).
* Remove gitignore for Makefiles for each configuration so that others can build it correctly too
* Move System configuration to config.h so it can be included in both

[ADD] hardware: Update PWP
* Correctly add tStop/bStop layer to TPA6017A2 to remove silkscreen from thermal pad

[ADD] hardware: BlueBus v6
* Version bump for new PCB run
* Remove passives from IBus line causing I/O issues
* Rewire gain settings on TPA6017A2 to 10dB gain, rather than 15.7dB
* Ensure all vias are 0.51mm
* Add Thermal Pad (PWP) to TPA6017A2 and update footprint to make more sense in mm
* Rewire VIN
* Rewire 5v regulator BS pin to pull from 5v rail rather than SW line (pre-inductor) per the DS