Soldermasked Vias and minor layout fixes solder masked vias to resolve soldering issues. Removed separated ground around RF output. Updated silkscreen to read v1.2 and prevent clipping of the L2 designator and value. Removed unnecessary ground vias. Fixed floating ground on BME280 sensor.

Updated Via Tenting now vias are untented

tracksoar v2 rev 5 converted to 4 layer board, covered via with solder mask, routed vcc and gnd on internal planes. Corrected AREF connection to ground via cap. Added analog pin connection to 15v to measure battery voltage. General routing cleanup.

Added Tracksoar Test Board This is the Tracksoar V2 Rev4 test board.

Added V1.2 board

Added V1.1 board layout

Initial commit