Michael Stetner / glass_udrive - History

minor routing and dimention and docu layer improvements.

improvements on slikscreen and component naming and placing.

Made glass net more compact.

Silk screen needs a lot of work

Went very OCD on your design

Made the power planes bigger because they had no reason not to be.

Renamed some nets because I found them confusing when looking at your schematic.

Moved stuff for cleaner routing.

Added a top ground plane to prevent stray capacitance onto any moving wires for
your electrode etc.

Improved via placement on bypass capacitors.

Re-organized schematic to some degree.

Renamed components to have more standard designator names, e.g. P1 instead of
'omnetics' and U1 instead of "AD82**"

Moved vias around to not make big breaks in the ground plane.

Messed with dimensions so they're all rectilinear and meet up with eachother.

Added optional circuit for 2nd INA channel and routing optimized.

Move bridge balance resistor up and trace from glass electrode to CAPCOM to layer 15

updated several board layout details: made it smaller H and W, changed
the anchoring tab on the opposite side, added +-15 power supply pours to
simplify routing and reduced bridge resistor size to 408 package 1/16 W
100Mohm resistor.