Files
You are viewing revision 53c269e2 from 08 Aug 11:11 finalize revB1
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esp32 / esp32.brd
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esp32 / esp32.sch
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paket1 / paket1.brd
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paket1 / paket1.sch
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paket8 / paket8 - dual.brd
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paket8 / paket8 - dual.sch
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paket8 / paket8.brd
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paket8 / paket8.sch
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paket9 / paket9.brd
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paket9 / paket9.sch
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paket_lengkap / paket_lengkap.brd
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paket_lengkap / paket_lengkap.sch
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pwm_to_v / pwm_to_v.brd
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pwm_to_v / pwm_to_v.sch
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pwm_to_v / Production / untitled-Panel.brd
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pwm_to_v / Production / Production / untitled-Panel-Panel.brd
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raspberry / raspberry.brd
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raspberry / raspberry.sch
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revB / PJU_revB.brd
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revB / PJU_revB.sch
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sim7000-shield / sim7000E-dummy.brd
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sim7000-shield / sim7000E-dummy.sch
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sim7000-shield / sim7000E-shield.brd
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sim7000-shield / sim7000E-shield.sch
| Filespwm_to_vProduction | |
|---|---|
| .. | |
| Production | |
| ordering_instructions.txt | |
| untitled-Panel.brd | |
| untitled-PanelizerSettings.txt | |
| untitled.dru |
ordering_instructions.txtpanel size, 210x154mm PCB thickness, 1.6mm number of layers, 2 soldermask color, Unknown silkscreen color, White oz copper, 1oz finish, HASL lead free stencils, none pcs per panel, 4 min trace width, 0.2540mm / 0.0100in min drill size, 0.4000mm / 0.0157in